News

According to the financial news on July 16, 2024, Tianyancha intellectual property information shows that Yangzhou Yangjie Electronic Technology Co., Ltd. has obtained a patent called "Semiconductor Welding Processing Jig", with authorization announcement number CN21337024U and application date of December 2023.

The patent abstract shows that semiconductor welding processing jig. It involves the field of semiconductor manufacturing. It includes a substrate fixing plate and a frame fixing plate, the substrate fixing plate is used to place a number of substrates, and the substrate is used to connect chips; the frame fixing plate is used to place a frame, the frame fixing plate is connected to the substrate fixing plate, and the several unit bodies in the frame are connected to the substrate one by one. The substrate fixing plate includes a plate body 1, and the middle of the two ends of the plate body 1 are respectively provided with a fixed notch, and the plate body 1 is provided with a pair of symmetrically arranged bosses on both sides of the fixed notch, and the bosses are provided with evenly distributed positioning holes; the utility model reduces costs and improves efficiency and product performance.