News

Mai Ruijie recently announced the completion of tens of millions of yuan in Pre-A+ round of financing, which was jointly completed by Shenzhen Venture Capital and Kunshi Capital.

As a developer focusing on semiconductor front-end glue coating and developing equipment, Mai Ruijie is committed to solving the country's high-end equipment localization problems in the fields of integrated circuit front-end wafer processing and back-end advanced packaging. This financing will mainly be used to accelerate the company's 12-inch front-end domestic glue coating and developing machine research and development process, and support the team's independent innovation platform construction.

This move will not only help break through the industry's "stuck neck" problem, but will also promote the further improvement and development of the domestic semiconductor industry chain.